Virtual Engineering Week is bringing a full week of best-in-class education to the global design, engineering, and manufacturing communities. Join us each morning to hear from medical device industry professionals during the Medtech Mornings series, and in the afternoons to learn from engineering and manufacturing experts in areas like 3D printing, smart manufacturing, packaging, materials and sustainability, and career development.
All times listed below are PST (Pacific Standard Time).
Herminso Villaraga-Gomez (X-ray Quality Solutions Manager , ZEISS Industrial Quality Solutions)
Date: Wednesday, December 2
Time: 10:15 am - 10:45 am
Track: Tech Theater
Vault Recording: TBD
Medical device manufacturers face quality and process control challenges when components need to be inspected without being destroyed, specially if they are relatively small. One of the main challenges of medical components mass production is the quality control assessment (e.g., parts may have internal features that are inaccessible from the outside to vision and contact-based inspection techniques). This presentation describes some of the main issues associated with the measurement of small medical devices, including a brief discussion of the limitations of traditional inspection technologies, such as coordinate measuring machines (CMMs) and optical-based systems. In addition, the particular case of 3D X-ray imaging as a technology to support medical devices quality inspection and new developments is discussed. X-ray microscopy and computed tomography techniques can generate detailed internal and external views of a device without destroying it. These capabilities speed up product development time, increase cost-effectiveness and simplify failure analysis and phase inspection of medication deliverables and other complex devices while supplying necessary data. At the present time, X-ray based technologies are also of particular relevance in the medical 3D printing and additive manufacturing (AM) industry as a viable option to explore the internal structure of AM parts and potentially answer questions about their structural integrity, tolerance limits, residual stresses, and a variety of dimensional deviations and internal flaws that may affect the functional performance of medical AM devices or create risks of potential failures.