Virtual Engineering Week is bringing a full week of best-in-class education to the global design, engineering, and manufacturing communities. Join us each morning to hear from medical device industry professionals during the Medtech Mornings series, and in the afternoons to learn from engineering and manufacturing experts in areas like 3D printing, smart manufacturing, packaging, materials and sustainability, and career development.
All times listed below are PST (Pacific Standard Time).
Mark Russell (Senior Global Market Manager, Medical Electronics, Bal Seal Engineering)
Date: Friday, December 4
Time: 10:15 am - 10:45 am
Track: Tech Theater
Vault Recording: TBD
How Interconnect Tech Advances Will Help Designers Shrink Neuro Device Packaging
This presentation will explore the push toward neuromodulation device size reduction, and the important role interconnects will play in developing smaller implants that can support current and future therapies. It will examine existing interconnect technologies and their basic construction, as well as the critical function of the interconnect and its impact on overall device size. Other topics will include recent advances in neuromodulation therapies (including brain-computer interfaces, cranially implanted devices, functional electrical stimulation), and a look at the benefits and drawbacks of vertically integrating vs. outsourcing interconnect manufacturing. Participants will also get a detailed look at new interconnect technologies that promise to reduce lead interface to near-microscopic sizes (.5mm diameters).
