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Virtual Engineering Week Schedule Viewer

Virtual Engineering Week is bringing a full week of best-in-class education to the global design, engineering, and manufacturing communities. Join us each morning to hear from medical device industry professionals during the Medtech Mornings series, and in the afternoons to learn from engineering and manufacturing experts in areas like 3D printing, smart manufacturing, packaging, materials and sustainability, and career development.

All times listed below are PST (Pacific Standard Time).

Micro Molding Case Study Supporting Small Ultra-High Precise Markets

Donna Bibber  (Vice President of Business Development, Isometric Micro Molding, Inc.)

Date: Thursday, December 3

Time: 11:15 am - 11:45 am

Track: Tech Theater

Vault Recording: TBD

Micro molding applications have skyrocketed in miniaturized device applications in recent years with the increased need for condensing and adding components in tiny spaces. Using Industry 4.0 analytics drive next generation device functionality and understanding micro molding processes and single micron tolerances is critical to new miniaturized device product platforms.

This technical and solutions-based presentation includes an actual case study from DMF through production using micro molding and associated tooling, assembly, and CT Scanning for:
• Wall thicknesses down to 50 microns (0.002”)
• Filter mesh of 50 microns (0.002”)
• Flushing out design criteria using 3d micro printing
• Using CT scanning to obtain quality DOE data in an expedited fashion
Overcoming technical challenges early in a micro molded program leads to the reduction of costly late-stage development project failures. This presentation will provide risk mitigation strategies to prevent these failures as early as 2 weeks into a micro molding program. Presented and collaborated with Isometric’s team of 4 subject matter experts with combined industry experience of over 95 years, this case study represents many of the most prevalent micro molding solutions required to support miniaturized device applications.